Part Details for GS8342D19BD-300I by GSI Technology
Overview of GS8342D19BD-300I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EL8300IUZ | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Tube | |
| ISL68300IRAZ-TK | Renesas Electronics Corporation | Scalable Single Output Digital PWM Controller with Integrated Driver and PMBus | |
| EL8300IU-T13 | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Reel |
Price & Stock for GS8342D19BD-300I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS8342D19BD-300I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342D19BD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$39.6720 / $45.1440 | Buy Now |
|
DISTI #
464-GS8342D19BD-300I
|
Mouser Electronics | SRAM 1.8 or 1.5V 2M x 18 36M | 0 |
|
$38.8500 / $48.3900 | Order Now |
Part Details for GS8342D19BD-300I
GS8342D19BD-300I CAD Models
GS8342D19BD-300I Part Data Attributes
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GS8342D19BD-300I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8342D19BD-300I
GSI Technology
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.21 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.54 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |