Datasheets
GS8342D19BD-300I by: GSI Technology

QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165

Part Details for GS8342D19BD-300I by GSI Technology

Overview of GS8342D19BD-300I by GSI Technology

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Price & Stock for GS8342D19BD-300I

Part # Distributor Description Stock Price Buy
DISTI # GS8342D19BD-300I
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342D19BD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $45.1440
  • 288 $44.3232
  • 576 $42.1344
  • 864 $41.0400
  • 1,152 $39.6720
  • 1,440 $37.7568
  • 14,400 $36.6624
$36.6624 / $45.1440 Buy Now
DISTI # 464-GS8342D19BD-300I
Mouser Electronics SRAM 1.8 or 1.5V 2M x 18 36M 0
  • 1 $48.3900
  • 10 $44.8800
  • 30 $43.2700
  • 60 $42.1900
  • 105 $38.8500
$38.8500 / $48.3900 Order Now

Part Details for GS8342D19BD-300I

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GS8342D19BD-300I Part Data Attributes

GS8342D19BD-300I GSI Technology
Buy Now Datasheet
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GS8342D19BD-300I GSI Technology QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.21 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.54 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for GS8342D19BD-300I

This table gives cross-reference parts and alternative options found for GS8342D19BD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8342D19BD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8342D19BD-300IT QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BD-300IT
GS8342D19BGD-300IT QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BGD-300IT
GS8342D19BGD-300I QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BGD-300I
Part Number Description Manufacturer Compare
GS8342D19BGD-300IT QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BGD-300IT
GS8342D19BGD-300I QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BGD-300I
GS8342D19BD-300IT QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8342D19BD-300I vs GS8342D19BD-300IT

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