Datasheets
GS82612QT37CE-250MQ by: GSI Technology

DDR SRAM,

Part Details for GS82612QT37CE-250MQ by GSI Technology

Overview of GS82612QT37CE-250MQ by GSI Technology

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Price & Stock for GS82612QT37CE-250MQ

Part # Distributor Description Stock Price Buy
DISTI # GS82612QT37CE-250M
Avnet Americas SRAM Chip Synchronous 1.8V 288M-bit 8M x 36 250MHz 165-Pin CCGA - Trays (Alt: GS82612QT37CE-250M) RoHS: Not Compliant Min Qty: 5 Package Multiple: 1 Lead time: 24 Weeks, 0 Days Container: Tray 0
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Part Details for GS82612QT37CE-250MQ

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GS82612QT37CE-250MQ Part Data Attributes

GS82612QT37CE-250MQ GSI Technology
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GS82612QT37CE-250MQ GSI Technology DDR SRAM,
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description CGA,
Reach Compliance Code compliant
ECCN Code 9A515.E.1
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
JESD-30 Code R-CBGA-X165
Length 25 mm
Memory Density 301989888 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8MX36
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.155 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Total Dose 200k Rad(Si) V
Width 21 mm

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