There are no models available for this part yet.
Overview of GS8162Z18DGD-333IV by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 2 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for GS8162Z18DGD-333IV by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS8162Z18DGD-333IV
|
Avnet Americas | SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 5ns/3ns 165-Pin FBGA - Bulk (Alt: GS8162Z18DGD-333IV) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$36.8232 / $45.3420 | Buy Now | |
|
DISTI #
464-8162Z18DGD333IV
|
Mouser Electronics | SRAM 1.8/2.5V 1M x 18 18M RoHS: Compliant | 0 |
|
$37.1300 / $48.6000 | Order Now |
CAD Models for GS8162Z18DGD-333IV by GSI Technology
Part Data Attributes for GS8162Z18DGD-333IV by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA,
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.B
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
24 Weeks
|
|
Access Time-Max
|
5 ns
|
|
Additional Feature
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
Length
|
15 mm
|
|
Memory Density
|
18874368 bit
|
|
Memory IC Type
|
ZBT SRAM
|
|
Memory Width
|
18
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
1048576 words
|
|
Number of Words Code
|
1000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
1MX18
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Supply Voltage-Max (Vsup)
|
2 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
13 mm
|
Alternate Parts for GS8162Z18DGD-333IV
This table gives cross-reference parts and alternative options found for GS8162Z18DGD-333IV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8162Z18DGD-333IV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8162Z18DGD-333V | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8162Z18DGD-333IV vs GS8162Z18DGD-333V |
| GS8162Z18DGD-333VT | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8162Z18DGD-333IV vs GS8162Z18DGD-333VT |