Datasheets
GS8162Z18DGD-200V by: GSI Technology

ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165

Part Details for GS8162Z18DGD-200V by GSI Technology

Overview of GS8162Z18DGD-200V by GSI Technology

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Price & Stock for GS8162Z18DGD-200V

Part # Distributor Description Stock Price Buy
DISTI # GS8162Z18DGD-200V
Avnet Americas SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 6.5ns/3ns 165-Pin FBGA - Bulk (Alt: GS8162Z18DGD-200V) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8162Z18DGD200V
Mouser Electronics SRAM 1.8/2.5V 1M x 18 18M RoHS: Compliant 0
  • 1 $36.8200
  • 10 $36.1900
  • 18 $31.0600
  • 108 $29.9200
  • 252 $29.3200
$29.3200 / $36.8200 Order Now
DISTI # GS8162Z18DGD-200V
Avnet Silica SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 6.5ns/3ns 165-Pin FBGA (Alt: GS8162Z18DGD-200V) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 9 Weeks, 0 Days Silica - 0
Buy Now

Part Details for GS8162Z18DGD-200V

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GS8162Z18DGD-200V Part Data Attributes

GS8162Z18DGD-200V GSI Technology
Buy Now Datasheet
Compare Parts:
GS8162Z18DGD-200V GSI Technology ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 6.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX18
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for GS8162Z18DGD-200V

This table gives cross-reference parts and alternative options found for GS8162Z18DGD-200V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8162Z18DGD-200V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8162Z18DGD-200IV ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200IV
GS8162Z18DGD-200IVT ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200IVT
GS8162Z18DGD-200VT ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200VT
Part Number Description Manufacturer Compare
GS8162Z18DGD-200IV ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200IV
GS8162Z18DGD-200IVT ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200IVT
GS8162Z18DGD-200VT ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8162Z18DGD-200V vs GS8162Z18DGD-200VT

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