There are no models available for this part yet.
Overview of GS8161Z18DGD-200 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for GS8161Z18DGD-200 by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS8161Z18DGD-200
|
Avnet Americas | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 6.5ns/3ns 165-Pin FBGA - Bulk (Alt: GS8161Z18DGD-200) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Container: Bulk | 0 |
|
$14.8740 / $18.3150 | Buy Now | |
DISTI #
464-GS8161Z18DGD-200
|
Mouser Electronics | SRAM 2.5 or 3.3V 1M x 18 18M RoHS: Compliant | 0 |
|
$15.0000 / $20.2300 | Order Now | |
DISTI #
GS8161Z18DGD-200
|
Avnet Silica | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 6.5ns/3ns 165-Pin FBGA (Alt: GS8161Z18DGD-200) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
CAD Models for GS8161Z18DGD-200 by GSI Technology
Part Data Attributes for GS8161Z18DGD-200 by GSI Technology
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
6.5 ns
|
Additional Feature
|
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Memory Density
|
18874368 bit
|
Memory IC Type
|
ZBT SRAM
|
Memory Width
|
18
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
1048576 words
|
Number of Words Code
|
1000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
1MX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
1.4 mm
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
13 mm
|