Part Details for GS8161Z18DD-150IV by GSI Technology
Overview of GS8161Z18DD-150IV by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS8161Z18DD-150IV
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8161Z18DD-150IV
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Avnet Americas | SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 7.5ns/3.8ns 165-Pin FBGA - Bulk (Alt: GS8161Z18DD-150IV) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$33.2340 / $37.8180 | Buy Now |
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DISTI #
464-GS8161Z18DD150IV
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Mouser Electronics | SRAM 1.8/2.5V 1M x 18 18M | 0 |
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$30.1100 / $40.5400 | Order Now |
Part Details for GS8161Z18DD-150IV
GS8161Z18DD-150IV CAD Models
GS8161Z18DD-150IV Part Data Attributes
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GS8161Z18DD-150IV
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8161Z18DD-150IV
GSI Technology
ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA165, FPBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 7.5 ns | |
| Additional Feature | FLOW THROUGH AND PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |