Part Details for GS81314LQ18GK-106I by GSI Technology
Overview of GS81314LQ18GK-106I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Communication and Networking
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ISL8106IRZ-T | Renesas Electronics Corporation | Wide VIN, 7V to 25V, Single-Phase PWM Controller with Integrated MOSFET Drivers | |
| ISL91106IINZ-T | Renesas Electronics Corporation | High Efficiency Buck-Boost Regulator with 3.6A Switches and Bypass Mode | |
| ISL8106IRZ | Renesas Electronics Corporation | Wide VIN, 7V to 25V, Single-Phase PWM Controller with Integrated MOSFET Drivers |
Price & Stock for GS81314LQ18GK-106I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS81314LQ18GK-106I
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Avnet Americas | SRAM Chip 144M-bit 8M x 18 1066MHz 260-Pin BGA - Trays (Alt: GS81314LQ18GK-106I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$474.1500 / $539.5500 | Buy Now |
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DISTI #
464-81314LQ18GK106I
|
Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
|
$437.7200 | Order Now |
Part Details for GS81314LQ18GK-106I
GS81314LQ18GK-106I CAD Models
GS81314LQ18GK-106I Part Data Attributes
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GS81314LQ18GK-106I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81314LQ18GK-106I
GSI Technology
QDR SRAM, 8MX18, CMOS, PBGA260, BGA-260
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | HBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 20 Weeks | |
| Date Of Intro | 2016-01-22 | |
| JESD-30 Code | R-PBGA-B260 | |
| Length | 22 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 8MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.3 mm | |
| Supply Voltage-Max (Vsup) | 1.35 V | |
| Supply Voltage-Min (Vsup) | 1.15 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |