Part Details for GS81313LQ18GK-714I by GSI Technology
Results Overview of GS81313LQ18GK-714I by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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GS81313LQ18GK-714I Information
GS81313LQ18GK-714I by GSI Technology is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for GS81313LQ18GK-714I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS81313LQ18GK-714I
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Avnet Americas | SRAM Chip Sync Single 1.3V 144Mbit 8M X 18 10ns 260-Pin BGA - Trays (Alt: GS81313LQ18GK-714I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$353.3400 / $377.5000 | Buy Now |
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DISTI #
464-81313LQ18GK714I
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Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
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$450.4700 | Order Now |
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DISTI #
GS81313LQ18GK-714I
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Avnet Silica | SRAM Chip Sync Single 13V 144Mbit 8M X 18 10ns 260Pin BGA (Alt: GS81313LQ18GK-714I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for GS81313LQ18GK-714I
GS81313LQ18GK-714I CAD Models
GS81313LQ18GK-714I Part Data Attributes
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GS81313LQ18GK-714I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81313LQ18GK-714I
GSI Technology
DDR SRAM, 8MX18, CMOS, PBGA260, BGA-260
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | HBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 20 Weeks | |
| Samacsys Manufacturer | GSI TECHNOLOGY | |
| JESD-30 Code | R-PBGA-B260 | |
| Length | 22 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 8MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.3 mm | |
| Supply Voltage-Max (Vsup) | 1.35 V | |
| Supply Voltage-Min (Vsup) | 1.2 V | |
| Supply Voltage-Nom (Vsup) | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |