Part Details for GS81313LD36GK-625 by GSI Technology
Overview of GS81313LD36GK-625 by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for GS81313LD36GK-625
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS81313LD36GK-625
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Avnet Americas | 144Mb SigmaQuad-IIIe Burst of 4 ECCRAM - Trays (Alt: GS81313LD36GK-625) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$371.2000 / $422.4000 | Buy Now |
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DISTI #
464-GS81313LD36GK625
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Mouser Electronics | SRAM 1.2/1.25V 4M x 36 144M RoHS: Compliant | 0 |
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$337.9000 / $342.1400 | Order Now |
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DISTI #
GS81313LD36GK-625
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Avnet Silica | 144Mb SigmaQuad-IIIe Burst of 4 ECCRAM (Alt: GS81313LD36GK-625) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for GS81313LD36GK-625
GS81313LD36GK-625 CAD Models
GS81313LD36GK-625 Part Data Attributes
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GS81313LD36GK-625
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81313LD36GK-625
GSI Technology
QDR SRAM, 4MX36, CMOS, PBGA260, BGA-260
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | HBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 20 Weeks | |
| JESD-30 Code | R-PBGA-B260 | |
| Length | 22 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.3 mm | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.15 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |