There are no models available for this part yet.
Overview of GS81302D11GE-400 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 4 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 4 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for GS81302D11GE-400 by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS81302D11GE-400
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS81302D11GE-400) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$157.1820 / $193.5450 | Buy Now | |
|
DISTI #
464-GS81302D11GE-400
|
Mouser Electronics | SRAM RoHS: Compliant | 0 |
|
$174.9000 | Order Now |
CAD Models for GS81302D11GE-400 by GSI Technology
Part Data Attributes for GS81302D11GE-400 by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA,
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.B
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
24 Weeks
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
Length
|
17 mm
|
|
Memory Density
|
150994944 bit
|
|
Memory IC Type
|
QDR II PLUS SRAM
|
|
Memory Width
|
9
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Organization
|
16MX9
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.5 mm
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
15 mm
|
Alternate Parts for GS81302D11GE-400
This table gives cross-reference parts and alternative options found for GS81302D11GE-400. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS81302D11GE-400, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS81302D11E-400IT | DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-400 vs GS81302D11E-400IT |
| GS81302D11GE-400IT | DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS81302D11GE-400 vs GS81302D11GE-400IT |
| GS81302D11E-400I | DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | GS81302D11GE-400 vs GS81302D11E-400I |
| GS81302D11GE-400I | DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | GS81302D11GE-400 vs GS81302D11GE-400I |