Part Details for GS81282Z36GD-400I by GSI Technology
Overview of GS81282Z36GD-400I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS81282Z36GD-400I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS81282Z36GD-400I
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Avnet Americas | SRAM Chip 144M-bit 4M x 36 400MHz 165-Pin BGA - Trays (Alt: GS81282Z36GD-400I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$261.0000 / $297.0000 | Buy Now |
DISTI #
464-GS81282Z36GD400I
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Mouser Electronics | SRAM 2.5/3.3V 4M x 36 144M RoHS: Compliant | 0 |
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$243.2300 | Order Now |
Part Details for GS81282Z36GD-400I
GS81282Z36GD-400I CAD Models
GS81282Z36GD-400I Part Data Attributes
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GS81282Z36GD-400I
GSI Technology
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Datasheet
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Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Package Description | , | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Date Of Intro | 2017-10-10 | |
Access Time-Max | 4 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO REQUIRES 3.3V NOMINAL SUPPLY VOLTAGE | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 165 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4MX36 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 100 A | |
Standby Voltage-Min | 2.3 V | |
Supply Current-Max | 0.69 mA | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |