Part Details for GS81282Z36GD-333 by GSI Technology
Overview of GS81282Z36GD-333 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS81282Z36GD-333
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS81282Z36GD-333
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Avnet Americas | SRAM Chip 144M-bit 4M x 36 333MHz 165-Pin BGA - Trays (Alt: GS81282Z36GD-333) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$172.0560 / $211.8600 | Buy Now |
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DISTI #
464-GS81282Z36GD-333
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Mouser Electronics | SRAM 2.5/3.3V 4M x 36 144M RoHS: Compliant | 0 |
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$191.5700 | Order Now |
Part Details for GS81282Z36GD-333
GS81282Z36GD-333 CAD Models
GS81282Z36GD-333 Part Data Attributes
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GS81282Z36GD-333
GSI Technology
Buy Now
Datasheet
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GS81282Z36GD-333
GSI Technology
SRAM,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Date Of Intro | 2017-10-10 | |
| Access Time-Max | 4.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO REQUIRES 3.3V NOMINAL SUPPLY VOLTAGE | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX36 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 120 A | |
| Standby Voltage-Min | 2.3 V | |
| Supply Current-Max | 0.62 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |