Part Details for GLT6200L08LL-55FI by G-Link Technology
Overview of GLT6200L08LL-55FI by G-Link Technology
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Part Details for GLT6200L08LL-55FI
GLT6200L08LL-55FI CAD Models
GLT6200L08LL-55FI Part Data Attributes:
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GLT6200L08LL-55FI
G-Link Technology
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Datasheet
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GLT6200L08LL-55FI
G-Link Technology
Standard SRAM, 256KX8, 55ns, CMOS, PBGA48
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | G-LINK TECHNOLOGY | |
| Package Description | FBGA, BGA48,6X8,30 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Terminals | 48 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.00001 A | |
| Standby Voltage-Min | 1 V | |
| Supply Current-Max | 0.03 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM |