Part Details for GLT5160L16-6FJ by G-Link Technology
Overview of GLT5160L16-6FJ by G-Link Technology
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Part Details for GLT5160L16-6FJ
GLT5160L16-6FJ CAD Models
GLT5160L16-6FJ Part Data Attributes
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GLT5160L16-6FJ
G-Link Technology
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Datasheet
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GLT5160L16-6FJ
G-Link Technology
Synchronous DRAM, 1MX16, 5.5ns, CMOS, PBGA60
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | G-LINK TECHNOLOGY | |
| Package Description | FBGA, BGA60,7X15,25 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 5.5 ns | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Terminals | 60 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA60,7X15,25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.002 A | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | BOTTOM |