Part Details for GLS85VM1016A-M-I-LFWE-ND200 by Greenliant Systems Ltd
Overview of GLS85VM1016A-M-I-LFWE-ND200 by Greenliant Systems Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| BPS8B96NND200L9LF | Amphenol Communications Solutions | DIN IDC Cable Connector, Side-pierce, Class I, 96 Position |
Price & Stock for GLS85VM1016A-M-I-LFWE-ND200
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GLS85VM1016A-M-I-L
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Avnet Americas | 16GB SSD, MLC NANDrive, 2.7-3.3Vdc, eMMC 4.4, BGA100 - Trays (Alt: GLS85VM1016A-M-I-L) RoHS: Compliant Min Qty: 98 Package Multiple: 98 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for GLS85VM1016A-M-I-LFWE-ND200
GLS85VM1016A-M-I-LFWE-ND200 CAD Models
GLS85VM1016A-M-I-LFWE-ND200 Part Data Attributes
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GLS85VM1016A-M-I-LFWE-ND200
Greenliant Systems Ltd
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Datasheet
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GLS85VM1016A-M-I-LFWE-ND200
Greenliant Systems Ltd
Flash Memory Drive, CMOS, PBGA100, 14 X 18 MM, 1.40 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, LBGA-100
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | GREENLIANT SYSTEMS LTD | |
| Part Package Code | BGA | |
| Package Description | 14 X 18 MM, 1.40 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, LBGA-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | Greenliant | |
| Host Data Transfer Rate-Max | 60 MBps | |
| JESD-30 Code | R-PBGA-B100 | |
| Length | 18 mm | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max | 3.3 V | |
| Supply Voltage-Min | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |