Part Details for GD5F1GQ4UCYIGR by GigaDevice Semiconductor (Beijing) Inc
Overview of GD5F1GQ4UCYIGR by GigaDevice Semiconductor (Beijing) Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for GD5F1GQ4UCYIGR
GD5F1GQ4UCYIGR CAD Models
GD5F1GQ4UCYIGR Part Data Attributes
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GD5F1GQ4UCYIGR
GigaDevice Semiconductor (Beijing) Inc
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Datasheet
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GD5F1GQ4UCYIGR
GigaDevice Semiconductor (Beijing) Inc
Flash, 256MX4, PDSO8, WSON-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | GIGADEVICE SEMICONDUCTOR INC | |
| Package Description | HSON, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 120 MHz | |
| JESD-30 Code | R-PDSO-N8 | |
| Length | 8 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HSON | |
| Package Equivalence Code | SOLCC8,.32 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Serial Bus Type | QSPI | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NAND TYPE | |
| Width | 6 mm |