Part Details for FTE256S8N-20C by Force Technologies Ltd
Overview of FTE256S8N-20C by Force Technologies Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
Part Details for FTE256S8N-20C
FTE256S8N-20C CAD Models
FTE256S8N-20C Part Data Attributes
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FTE256S8N-20C
Force Technologies Ltd
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Datasheet
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FTE256S8N-20C
Force Technologies Ltd
EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FORCE TECHNOLOGIES LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| Data Polling | YES | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 41.91 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 128 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 10.16 mm | |
| Standby Current-Max | 0.0012 A | |
| Supply Current-Max | 0.09 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | NO | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for FTE256S8N-20C
This table gives cross-reference parts and alternative options found for FTE256S8N-20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FTE256S8N-20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| FTE256S8N-20B | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | FTE256S8N-20C vs FTE256S8N-20B |
| 5962-9309105HYC | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 | Mercury Systems Inc | FTE256S8N-20C vs 5962-9309105HYC |
| AT28C040-20BM/883 | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | FTE256S8N-20C vs AT28C040-20BM/883 |
| AT28C040-20BJSL703 | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | FTE256S8N-20C vs AT28C040-20BJSL703 |
| AT28C040-20BM/883 | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32 | Microchip Technology Inc | FTE256S8N-20C vs AT28C040-20BM/883 |
| AT28C040-20BM | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | FTE256S8N-20C vs AT28C040-20BM |
| AT28C040-20BC | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | FTE256S8N-20C vs AT28C040-20BC |