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Part Details for FR1003GP-TP by Micro Commercial Components
Results Overview of FR1003GP-TP by Micro Commercial Components
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
FR1003GP-TP Information
FR1003GP-TP by Micro Commercial Components is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for FR1003GP-TP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
FR1003GP-TP-ND
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DigiKey | DIODE STANDARD 200V 10A R6 Min Qty: 500 Lead time: 16 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$0.1405 / $0.2367 | Buy Now |
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DISTI #
833-FR1003GP-TP
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Mouser Electronics | Rectifiers 10A FAST RECOVEY RECTIFIER RoHS: Compliant | 0 |
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Order Now | |
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DISTI #
FR1003GP-TP
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IBS Electronics | FR1003GP-TP by MCC is a fast recovery rectifier diode with a 1000V reverse voltage, 1A forward curre... more Min Qty: 500 Package Multiple: 1 | 0 |
|
$0.1968 / $0.2101 | Buy Now |
Part Details for FR1003GP-TP
FR1003GP-TP CAD Models
FR1003GP-TP Part Data Attributes
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FR1003GP-TP
Micro Commercial Components
Buy Now
Datasheet
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FR1003GP-TP
Micro Commercial Components
Rectifier Diode,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | MICRO COMMERCIAL COMPONENTS CORP | |
| Package Description | O-PALF-W2 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | MCC | |
| Additional Feature | LOW LEAKAGE CURRENT | |
| Application | FAST RECOVERY | |
| Breakdown Voltage-Min | 200 V | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.3 V | |
| JESD-30 Code | O-PALF-W2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 250 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 10 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Peak Reflow Temperature (Cel) | 260 | |
| Rep Pk Reverse Voltage-Max | 200 V | |
| Reverse Current-Max | 5 µA | |
| Reverse Recovery Time-Max | 0.15 µs | |
| Reverse Test Voltage | 200 V | |
| Surface Mount | NO | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | WIRE | |
| Terminal Position | AXIAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 |
FR1003GP-TP Frequently Asked Questions (FAQ)
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The recommended land pattern for FR1003GP-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
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The thermal pad of FR1003GP-TP should be connected to a copper plane on the PCB to dissipate heat efficiently. It's recommended to use a thermal interface material (TIM) between the thermal pad and the copper plane to reduce thermal resistance.
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The maximum operating temperature range for FR1003GP-TP is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
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Yes, FR1003GP-TP is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to follow proper PCB design and assembly guidelines to ensure the device's reliability in high-vibration environments.
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To ensure the reliability of FR1003GP-TP in high-humidity environments, it's recommended to follow proper PCB design and assembly guidelines, including the use of moisture-resistant materials and conformal coating. Additionally, the device should be stored in a dry environment before assembly and soldering.