Part Details for FDG6332C-F085P by onsemi
Results Overview of FDG6332C-F085P by onsemi
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FDG6332C-F085P Information
FDG6332C-F085P by onsemi is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FDG6332C-F085P
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
FDG6332C-F085P
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EBV Elektronik | Trans MOSFET Array NCHPCH 20V 0706A 6Pin SC70 TR (Alt: FDG6332C-F085P) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Transistors | 2630 |
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RFQ |
Part Details for FDG6332C-F085P
FDG6332C-F085P CAD Models
FDG6332C-F085P Part Data Attributes
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FDG6332C-F085P
onsemi
Buy Now
Datasheet
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Compare Parts:
FDG6332C-F085P
onsemi
20V N & P Channel PowerTrench® MOSFETs, SC70 6L, 3000-REEL, Automotive Qualified
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SC70 6L | |
| Package Description | SC-70, 6 PIN | |
| Manufacturer Package Code | 419AD | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | onsemi | |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 20 V | |
| Drain Current-Max (ID) | 0.7 A | |
| Drain-source On Resistance-Max | 0.3 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G6 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 2 | |
| Number of Terminals | 6 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL AND P-CHANNEL | |
| Power Dissipation-Max (Abs) | 0.3 W | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
FDG6332C-F085P Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
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To ensure proper biasing, follow the recommended biasing circuit in the datasheet, and make sure the voltage supply is stable and within the recommended range. Also, ensure that the input signals are within the specified voltage range and that the device is operated within the recommended temperature range.
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Critical parameters to monitor during device operation include the drain-source voltage (Vds), gate-source voltage (Vgs), drain current (Id), and junction temperature (Tj). Monitoring these parameters can help prevent device damage and ensure optimal performance.
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To protect the device from ESD, handle the device by the body or use an ESD wrist strap, and ensure that the workspace is ESD-safe. Also, use ESD protection devices such as TVS diodes or ESD protection arrays on the PCB, and follow proper PCB design guidelines for ESD protection.
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The recommended soldering conditions for the FDG6332C-F085P include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.