Datasheets
FDD8444L-F085 by:
onsemi
Fairchild Semiconductor Corporation
onsemi
Not Found

N-Channel PowerTrench® MOSFET, 40V, 50A, 6.0mΩ,, TO-252 3L (DPAK), 2500-REEL, Automotive Qualified

Part Details for FDD8444L-F085 by onsemi

Results Overview of FDD8444L-F085 by onsemi

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FDD8444L-F085 Information

FDD8444L-F085 by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for FDD8444L-F085

Part # Distributor Description Stock Price Buy
Rochester Electronics FDD8444L_F085 - N-Channel PowerTrench MOSFET, 40V, 50A, 6.0m, RoHS: Compliant Status: Obsolete Min Qty: 1 4213
  • 1 $0.9317
  • 25 $0.9131
  • 100 $0.8758
  • 500 $0.8385
  • 1,000 $0.7919
$0.7919 / $0.9317 Buy Now
DISTI # FDD8444L-F085
Avnet Silica Trans MOSFET NCH 40V 16A 3Pin2Tab TO252 TR (Alt: FDD8444L-F085) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # FDD8444L-F085
EBV Elektronik Trans MOSFET NCH 40V 16A 3Pin2Tab TO252 TR (Alt: FDD8444L-F085) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now
Vyrian Transistors 5143
RFQ

Part Details for FDD8444L-F085

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FDD8444L-F085 Part Data Attributes

FDD8444L-F085 onsemi
Buy Now Datasheet
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FDD8444L-F085 onsemi N-Channel PowerTrench® MOSFET, 40V, 50A, 6.0mΩ,, TO-252 3L (DPAK), 2500-REEL, Automotive Qualified
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code TO-252 3L (DPAK)
Package Description DPAK-3/2
Manufacturer Package Code 369AS
Reach Compliance Code not_compliant
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Avalanche Energy Rating (Eas) 295 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 40 V
Drain-source On Resistance-Max 0.0065 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-252AA
JESD-30 Code R-PSSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 153 W
Reference Standard AEC-Q101
Surface Mount YES
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form GULL WING
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON

FDD8444L-F085 Related Parts

FDD8444L-F085 Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.

  • The device requires a stable input voltage (VIN) and a bias voltage (VCC) between 4.5V to 5.5V. Ensure the input voltage is within the recommended range and the bias voltage is decoupled with a 10uF capacitor.

  • The maximum allowable power dissipation is 1.4W. Ensure the device is operated within the recommended thermal and power dissipation limits to prevent overheating and damage.

  • The device is rated for operation up to 150°C. However, the maximum junction temperature (TJ) should not exceed 175°C. Ensure proper thermal management and heat sinking to prevent overheating.

  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use ESD-protective packaging and storage materials to prevent damage during transportation and storage.