Part Details for FDC37C93XAPM by SMSC
Overview of FDC37C93XAPM by SMSC
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Part Details for FDC37C93XAPM
FDC37C93XAPM CAD Models
FDC37C93XAPM Part Data Attributes:
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FDC37C93XAPM
SMSC
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Datasheet
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FDC37C93XAPM
SMSC
Multifunction Peripheral, CMOS, PQFP16, QFP-160
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STANDARD MICROSYSTEMS CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | GAME PORT | |
| Address Bus Width | 12 | |
| Boundary Scan | NO | |
| Bus Compatibility | IBM PC-XT; IBM PC-AT; PS/2; ISA | |
| Clock Frequency-Max | 14.318 MHz | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G16 | |
| JESD-609 Code | e0 | |
| Length | 28 mm | |
| Number of I/O Lines | 22 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.07 mm | |
| Supply Current-Max | 90 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 28 mm |