Part Details for F1162NBGI by Integrated Device Technology Inc
Overview of F1162NBGI by Integrated Device Technology Inc
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Part Details for F1162NBGI
F1162NBGI CAD Models
F1162NBGI Part Data Attributes:
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F1162NBGI
Integrated Device Technology Inc
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F1162NBGI
Integrated Device Technology Inc
VFQFPN-36, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Package Description | QFN-36 | |
| Pin Count | 36 | |
| Manufacturer Package Code | NBG36P1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-XQCC-N36 | |
| JESD-609 Code | e3 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 36 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 6 mm |