Part Details for F1150NBGI by Integrated Device Technology Inc
Overview of F1150NBGI by Integrated Device Technology Inc
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Applications
Telecommunications
Part Details for F1150NBGI
F1150NBGI CAD Models
F1150NBGI Part Data Attributes:
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F1150NBGI
Integrated Device Technology Inc
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F1150NBGI
Integrated Device Technology Inc
VFQFPN-36, Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | VFQFPN | |
Package Description | QFN-36 | |
Pin Count | 36 | |
Manufacturer Package Code | NBG36P1 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-XQCC-N36 | |
JESD-609 Code | e3 | |
Length | 6 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 6 mm |