Part Details for F100416DC by Fairchild Semiconductor Corporation
Overview of F100416DC by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for F100416DC
F100416DC CAD Models
F100416DC Part Data Attributes:
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F100416DC
Fairchild Semiconductor Corporation
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Datasheet
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F100416DC
Fairchild Semiconductor Corporation
OTP ROM, 256X4, ECL100K, CDIP16,
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Package Description | DIP, DIP16,.3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
JESD-30 Code | R-XDIP-T16 | |
JESD-609 Code | e0 | |
Memory Density | 1024 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Moisture Sensitivity Level | 2A | |
Number of Terminals | 16 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 256X4 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | ECL100K | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for F100416DC
This table gives cross-reference parts and alternative options found for F100416DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of F100416DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27S20PCB | OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | F100416DC vs AM27S20PCB |
N82S129AD-T | 256X4 OTPROM, 27ns, PDSO16 | Philips Semiconductors | F100416DC vs N82S129AD-T |
M38510/20302BEX | IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM | NXP Semiconductors | F100416DC vs M38510/20302BEX |
M38510/20304BEA | IC 256 X 4 OTPROM, 35 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM | NXP Semiconductors | F100416DC vs M38510/20304BEA |
DM74S287N | 256X4 OTPROM, 50ns, PDIP16, PLASTIC, DIP-16 | Texas Instruments | F100416DC vs DM74S287N |
AM27S20ADC | OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | F100416DC vs AM27S20ADC |
53S141J | OTP ROM, 256X4, 55ns, CMOS, CDIP16, | Monolithic Memories (RETIRED) | F100416DC vs 53S141J |
AM27S21PC | OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 | Rochester Electronics LLC | F100416DC vs AM27S21PC |
N82S229B | 256X4 OTPROM, 50ns, PDIP16 | Philips Semiconductors | F100416DC vs N82S229B |
TBP24S10MJ | 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | F100416DC vs TBP24S10MJ |