Datasheets
F100416DC by: Fairchild Semiconductor Corporation

OTP ROM, 256X4, ECL100K, CDIP16,

Part Details for F100416DC by Fairchild Semiconductor Corporation

Overview of F100416DC by Fairchild Semiconductor Corporation

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Part Details for F100416DC

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F100416DC Part Data Attributes:

F100416DC Fairchild Semiconductor Corporation
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F100416DC Fairchild Semiconductor Corporation OTP ROM, 256X4, ECL100K, CDIP16,
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP
Package Description DIP, DIP16,.3
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-XDIP-T16
JESD-609 Code e0
Memory Density 1024 bit
Memory IC Type OTP ROM
Memory Width 4
Moisture Sensitivity Level 2A
Number of Terminals 16
Number of Words 256 words
Number of Words Code 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 256X4
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
Surface Mount NO
Technology ECL100K
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for F100416DC

This table gives cross-reference parts and alternative options found for F100416DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of F100416DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27S20PCB OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD F100416DC vs AM27S20PCB
N82S129AD-T 256X4 OTPROM, 27ns, PDSO16 Philips Semiconductors F100416DC vs N82S129AD-T
M38510/20302BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors F100416DC vs M38510/20302BEX
M38510/20304BEA IC 256 X 4 OTPROM, 35 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors F100416DC vs M38510/20304BEA
DM74S287N 256X4 OTPROM, 50ns, PDIP16, PLASTIC, DIP-16 Texas Instruments F100416DC vs DM74S287N
AM27S20ADC OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD F100416DC vs AM27S20ADC
53S141J OTP ROM, 256X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) F100416DC vs 53S141J
AM27S21PC OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 Rochester Electronics LLC F100416DC vs AM27S21PC
N82S229B 256X4 OTPROM, 50ns, PDIP16 Philips Semiconductors F100416DC vs N82S229B
TBP24S10MJ 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 Texas Instruments F100416DC vs TBP24S10MJ

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