Part Details for EPF6016BC256-2 by Altera Corporation
Overview of EPF6016BC256-2 by Altera Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for EPF6016BC256-2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-EPF6016BC256-2-ND
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DigiKey | IC FPGA 204 I/O 256FBGA Min Qty: 6 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
733 In Stock |
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$59.8100 | Buy Now |
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Bristol Electronics | 50 |
|
RFQ | ||
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Quest Components | Field-Programmable Gate Array, 1320 Cell, 256 Pin, Plastic, BGA | 2 |
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$50.0468 | Buy Now |
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Rochester Electronics | FLEX 6000 Programmable Logic Device RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 733 |
|
RFQ |
Part Details for EPF6016BC256-2
EPF6016BC256-2 CAD Models
EPF6016BC256-2 Part Data Attributes
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EPF6016BC256-2
Altera Corporation
Buy Now
Datasheet
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EPF6016BC256-2
Altera Corporation
Loadable PLD, CMOS, PBGA256, BGA-256
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Additional Feature | CAN ALSO BE USED 16000 LOGIC GATES | |
Clock Frequency-Max | 153 MHz | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 204 | |
Number of Inputs | 204 | |
Number of Logic Cells | 1320 | |
Number of Outputs | 204 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 4 DEDICATED INPUTS, 204 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256(UNSPEC) | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 220 | |
Programmable Logic Type | LOADABLE PLD | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.3 mm | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 27 mm |
Alternate Parts for EPF6016BC256-2
This table gives cross-reference parts and alternative options found for EPF6016BC256-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPF6016BC256-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
EPF6016BC256-2 | Loadable PLD, CMOS, PBGA256, BGA-256 | Intel Corporation | EPF6016BC256-2 vs EPF6016BC256-2 |