Datasheets
EPF10K100BFC256-2 by:

LOADABLE PLD, 12 ns, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256

Part Details for EPF10K100BFC256-2 by Rochester Electronics LLC

Overview of EPF10K100BFC256-2 by Rochester Electronics LLC

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Part Details for EPF10K100BFC256-2

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EPF10K100BFC256-2 Part Data Attributes

EPF10K100BFC256-2 Rochester Electronics LLC
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EPF10K100BFC256-2 Rochester Electronics LLC LOADABLE PLD, 12 ns, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code unknown
Additional Feature 4992 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Number of I/O Lines 191
Number of Terminals 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 191 I/O
Output Function MIXED
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD
Propagation Delay 12 ns
Qualification Status COMMERCIAL
Seated Height-Max 2.1 mm
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

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