Datasheets
EPCQ4ASI8N by:
Intel Corporation
Altera Corporation
Intel Corporation
Not Found

Memory Circuit, 512KX8, CMOS, PDSO8, SOIC-8

Part Details for EPCQ4ASI8N by Intel Corporation

Results Overview of EPCQ4ASI8N by Intel Corporation

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

EPCQ4ASI8N Information

EPCQ4ASI8N by Intel Corporation is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for EPCQ4ASI8N

Part # Distributor Description Stock Price Buy
DISTI # 544-3442-ND
DigiKey IC CONFIG DEVICE 4MBIT 8SOIC Min Qty: 1 Lead time: 20 Weeks Container: Tube 12044
In Stock
  • 1 $10.6700
$10.6700 Buy Now
DISTI # SMC-EPCQ4ASI8N
Sensible Micro Corporation OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days 200
RFQ
Win Source Electronics IC CONFIG DEVICE 4MBIT 8SOIC 5599
  • 5 $10.9859
  • 12 $9.0141
  • 18 $8.7324
  • 24 $8.4507
  • 31 $8.1691
  • 41 $7.3240
$7.3240 / $10.9859 Buy Now

Part Details for EPCQ4ASI8N

EPCQ4ASI8N CAD Models

EPCQ4ASI8N Part Data Attributes

EPCQ4ASI8N Intel Corporation
Buy Now Datasheet
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EPCQ4ASI8N Intel Corporation Memory Circuit, 512KX8, CMOS, PDSO8, SOIC-8
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description SOIC-8
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.32.00.51
Date Of Intro 2017-08-04
Samacsys Manufacturer Intel
Clock Frequency-Max (fCLK) 100 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Length 4.9 mm
Memory Density 4194304 bit
Memory IC Type CONFIGURATION MEMORY
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 8
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

EPCQ4ASI8N Related Parts

EPCQ4ASI8N Frequently Asked Questions (FAQ)

  • Intel recommends a 4-layer PCB with a solid ground plane, and a thermal design that ensures a maximum junction temperature of 100°C. A thermal pad on the bottom of the package helps with heat dissipation.

  • Use a signal integrity analysis tool to optimize trace lengths, impedance, and termination. Implement a multi-layer PCB with a solid ground plane, and use differential signaling and shielding to minimize noise.

  • The EPCQ4ASI8N requires a power-on sequence of VCCIO, then VCC, and a ramp-up time of 100 ms to ensure proper device operation and prevent latch-up.

  • Use a high-quality clock source, such as a crystal oscillator, and implement a clock tree with a single clock domain. Ensure clock signal integrity by using a clock buffer and minimizing clock skew.

  • Use a combination of high-frequency and low-frequency decoupling capacitors, with a total capacitance of at least 100 nF, and implement a power filter with a ferrite bead and a bypass capacitor to minimize power noise.