Part Details for EP3SL200F1152C2N by Intel Corporation
Overview of EP3SL200F1152C2N by Intel Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for EP3SL200F1152C2N
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
VN5:3623_28472028
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Arrow Electronics | FPGA Stratix® III L Family 200000 Cells 600MHz 65nm Technology 1.1V 1152-Pin FC-FBGA Min Qty: 1 Package Multiple: 1 Lead time: 99 Weeks Date Code: 2125 | Americas - 61 |
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$757.9500 / $942.2200 | Buy Now |
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DISTI #
71296181
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Verical | FPGA Stratix® III L Family 200000 Cells 600MHz 65nm Technology 1.1V 1152-Pin FC-FBGA Min Qty: 1 Package Multiple: 1 Date Code: 2125 | Americas - 61 |
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$757.9500 / $942.2200 | Buy Now |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks | 39 Stock,90 Available |
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$2,078.5300 / $2,640.7600 | Buy Now |
Part Details for EP3SL200F1152C2N
EP3SL200F1152C2N CAD Models
EP3SL200F1152C2N Part Data Attributes
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EP3SL200F1152C2N
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
EP3SL200F1152C2N
Intel Corporation
Field Programmable Gate Array, 800MHz, 200000-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Number of CLBs | 8000 | |
| Number of Inputs | 744 | |
| Number of Logic Cells | 200000 | |
| Number of Outputs | 744 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 8000 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.6 mm | |
| Supply Voltage-Max | 0.94 V | |
| Supply Voltage-Min | 0.86 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |
Alternate Parts for EP3SL200F1152C2N
This table gives cross-reference parts and alternative options found for EP3SL200F1152C2N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3SL200F1152C2N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EP3SL200F1152C2G | Field Programmable Gate Array, 200000-Cell, PBGA1152, FBGA-1152 | Intel Corporation | EP3SL200F1152C2N vs EP3SL200F1152C2G |