Part Details for EP2AGX65DF29I3G by Intel Corporation
Overview of EP2AGX65DF29I3G by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Price & Stock for EP2AGX65DF29I3G
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
EP2AGX65DF29I3G-ND
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DigiKey | IC FPGA 364 I/O 780FBGA Min Qty: 36 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$1,457.2858 | Buy Now |
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Ameya Holding Limited | 3000 |
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RFQ |
Part Details for EP2AGX65DF29I3G
EP2AGX65DF29I3G CAD Models
EP2AGX65DF29I3G Part Data Attributes
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EP2AGX65DF29I3G
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
EP2AGX65DF29I3G
Intel Corporation
Field Programmable Gate Array, 60214-Cell, PBGA780, FBGA-780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B780 | |
| Length | 29 mm | |
| Number of CLBs | 2530 | |
| Number of Inputs | 372 | |
| Number of Logic Cells | 60214 | |
| Number of Outputs | 372 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2530 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm |