Part Details for EP2AGX125EF35C4N by Intel Corporation
Overview of EP2AGX125EF35C4N by Intel Corporation
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Part Details for EP2AGX125EF35C4N
EP2AGX125EF35C4N CAD Models
EP2AGX125EF35C4N Part Data Attributes
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EP2AGX125EF35C4N
Intel Corporation
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Datasheet
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EP2AGX125EF35C4N
Intel Corporation
Field Programmable Gate Array, 500MHz, 118143-Cell, CMOS, PBGA1152, 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Clock Frequency-Max | 500 MHz | |
| JESD-30 Code | S-PBGA-B1152 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 4964 | |
| Number of Inputs | 612 | |
| Number of Logic Cells | 118143 | |
| Number of Outputs | 612 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 4964 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |