There are no models available for this part yet.
Overview of EOB2UV6482B-60TG-S by FUJITSU Limited
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
0805HS-560TGBB | Coilcraft Inc | General Purpose Inductor, 0.056uH, 2%, 1 Element, Ceramic-Core, SMD, 0806, CHIP, 0805 | |
1008HS-560TGBB | Coilcraft Inc | General Purpose Inductor, 0.056uH, 2%, 1 Element, Ceramic-Core, SMD, 1110, CHIP, 1008 | |
1008HS-560TGL | Coilcraft Inc | RF inductor, ceramic core, 2% tol, SMT, RoHS |
CAD Models for EOB2UV6482B-60TG-S by FUJITSU Limited
Part Data Attributes for EOB2UV6482B-60TG-S by FUJITSU Limited
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FUJITSU LTD
|
Package Description
|
DIMM, DIMM144,32
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.02
|
Access Time-Max
|
60 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDMA-N144
|
Memory Density
|
134217728 bit
|
Memory IC Type
|
EDO DRAM MODULE
|
Memory Width
|
64
|
Number of Terminals
|
144
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
2MX64
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIMM
|
Package Equivalence Code
|
DIMM144,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status
|
Not Qualified
|
Refresh Cycles
|
2048
|
Seated Height-Max
|
25.4 mm
|
Self Refresh
|
NO
|
Standby Current-Max
|
0.008 A
|
Supply Current-Max
|
0.88 mA
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
DUAL
|