Part Details for EMS256K8AMO2-35M by ELMOS SEMICONDUCTOR AG
Overview of EMS256K8AMO2-35M by ELMOS SEMICONDUCTOR AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LPS6235-123MLC | Coilcraft Inc | General Purpose Inductor, 12uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT | |
| LPS6235-183MLC | Coilcraft Inc | General Purpose Inductor, 18uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT | |
| LPS6235-334MLC | Coilcraft Inc | General Purpose Inductor, 330uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-35M, CHIP, 6262-35M, ROHS COMPLIANT |
Part Details for EMS256K8AMO2-35M
EMS256K8AMO2-35M CAD Models
EMS256K8AMO2-35M Part Data Attributes
|
|
EMS256K8AMO2-35M
ELMOS SEMICONDUCTOR AG
Buy Now
Datasheet
|
Compare Parts:
EMS256K8AMO2-35M
ELMOS SEMICONDUCTOR AG
SRAM Module, 256KX8, 35ns, CMOS, CDMA32
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ELMO SEMICONDUCTOR CORP | |
| Package Description | DIP, DIP32,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDMA-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B (Modified) | |
| Standby Current-Max | 0.0005 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.34 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for EMS256K8AMO2-35M
This table gives cross-reference parts and alternative options found for EMS256K8AMO2-35M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EMS256K8AMO2-35M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EDI88257C70CB | Standard SRAM, 256KX8, 70ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EMS256K8AMO2-35M vs EDI88257C70CB |
| MSM8256VM-45/X0252 | SRAM Module, 256KX8, 45ns, CMOS, CDIP32, 0.100 INCH, CERAMIC, VIL-32 | APTA Group Inc | EMS256K8AMO2-35M vs MSM8256VM-45/X0252 |
| MSM8256VLI-35/X0252 | SRAM Module, 256KX8, 35ns, CMOS, CDIP32, 0.100 INCH, CERAMIC, VIL-32 | APTA Group Inc | EMS256K8AMO2-35M vs MSM8256VLI-35/X0252 |
| EMS256K8BMO2-45I | SRAM Module, 256KX8, 45ns, CMOS, CDMA32 | ELMOS SEMICONDUCTOR AG | EMS256K8AMO2-35M vs EMS256K8BMO2-45I |
| EDI8M8256P150C6C | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EMS256K8AMO2-35M vs EDI8M8256P150C6C |
| 5962-9315708HXX | SRAM Module, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | EMS256K8AMO2-35M vs 5962-9315708HXX |
| MS8256SCMB-55 | SRAM Module, 256KX8, 55ns, CMOS | Mosaic Semiconductor Inc | EMS256K8AMO2-35M vs MS8256SCMB-55 |
| EDI8M8256P150B6M | SRAM Module, 256KX8, 150ns, CMOS, | Electronic Designs Inc | EMS256K8AMO2-35M vs EDI8M8256P150B6M |
| EDI8M8257LP100P6C | SRAM Module, 256KX8, 100ns, CMOS, | Electronic Designs Inc | EMS256K8AMO2-35M vs EDI8M8257LP100P6C |
| EDI8M8257LP85N6M | SRAM Module, 256KX8, 85ns, CMOS, | Electronic Designs Inc | EMS256K8AMO2-35M vs EDI8M8257LP85N6M |