Part Details for EL5327CLZ-T13 by Renesas Electronics Corporation
Overview of EL5327CLZ-T13 by Renesas Electronics Corporation
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Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Audio and Video Systems
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Entertainment and Gaming
Automotive
Part Details for EL5327CLZ-T13
EL5327CLZ-T13 CAD Models
EL5327CLZ-T13 Part Data Attributes
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EL5327CLZ-T13
Renesas Electronics Corporation
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EL5327CLZ-T13
Renesas Electronics Corporation
Buffer Amplifier
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Package Description | HVQCCN, LCC24,.16X.2,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Amplifier Type | BUFFER | |
Average Bias Current-Max (IIB) | 0.05 µA | |
Bandwidth (3dB)-Nom | 2.5 MHz | |
Bias Current-Max (IIB) @25C | 0.05 µA | |
Input Offset Voltage-Max | 15000 µV | |
JESD-30 Code | R-XQCC-N24 | |
JESD-609 Code | e3 | |
Length | 5 mm | |
Neg Supply Voltage Limit-Max | -9 V | |
Neg Supply Voltage-Nom (Vsup) | -5 V | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC24,.16X.2,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Seated Height-Max | 1 mm | |
Slew Rate-Min | 0.9 V/us | |
Slew Rate-Nom | 2.2 V/us | |
Supply Current-Max | 2 mA | |
Supply Voltage Limit-Max | 9 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 4 mm |