Datasheets
EFM32GG290F512G-E-BGA112 by: Silicon Laboratories Inc

RISC Microcontroller, CMOS

Part Details for EFM32GG290F512G-E-BGA112 by Silicon Laboratories Inc

Overview of EFM32GG290F512G-E-BGA112 by Silicon Laboratories Inc

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

Price & Stock for EFM32GG290F512G-E-BGA112

Part # Distributor Description Stock Price Buy
DISTI # EFM32GG290F512G-E-BGA112-ND
DigiKey IC MCU 32BIT 512KB FLASH 112BGA Min Qty: 1 Lead time: 12 Weeks Container: Tray Temporarily Out of Stock
  • 1 $13.8900
  • 10 $12.7680
  • 25 $12.2388
  • 168 $10.7833
  • 336 $10.2540
  • 504 $9.5925
  • 1,008 $8.7986
$8.7986 / $13.8900 Buy Now
DISTI # 634-32GG290F512-E
Mouser Electronics ARM Microcontrollers - MCU 512k Flash, 128k RAM, AES RoHS: Compliant 24
  • 1 $14.1700
  • 10 $13.0300
  • 25 $12.2400
  • 100 $10.7900
  • 250 $10.2600
  • 500 $9.6000
  • 840 $8.7900
$8.7900 / $14.1700 Buy Now
Symmetry Electronics   Min Qty: 1 0
  • 1 $8.8400
$8.8400 Buy Now

Part Details for EFM32GG290F512G-E-BGA112

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EFM32GG290F512G-E-BGA112 Part Data Attributes:

EFM32GG290F512G-E-BGA112 Silicon Laboratories Inc
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EFM32GG290F512G-E-BGA112 Silicon Laboratories Inc RISC Microcontroller, CMOS
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SILICON LABORATORIES INC
Package Description BGA-112
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Date Of Intro 2016-05-18
Samacsys Manufacturer Silicon Labs
Has ADC YES
Address Bus Width 28
Boundary Scan NO
CPU Family EFM32
Clock Frequency-Max 48 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PBGA-B112
JESD-609 Code e4
Length 10 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels 12
Number of External Interrupts 16
Number of I/O Lines 90
Number of Terminals 112
Number of Timers 4
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA112,11X11,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (words) 131072
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 1.3 mm
Speed 48 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.8 V
Supply Voltage-Min 1.98 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish NICKEL GOLD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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