Part Details for EDI8M3264C55C6B by Electronic Designs Inc
Overview of EDI8M3264C55C6B by Electronic Designs Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for EDI8M3264C55C6B
EDI8M3264C55C6B CAD Models
EDI8M3264C55C6B Part Data Attributes
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EDI8M3264C55C6B
Electronic Designs Inc
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Datasheet
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EDI8M3264C55C6B
Electronic Designs Inc
SRAM Module, 256KX8, 55ns, CMOS,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ELECTRONIC DESIGNS INC | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
Additional Feature | CONFIGURABLE AS 64K X 32 | |
Alternate Memory Width | 16 | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-T60 | |
JESD-609 Code | e0 | |
Memory Density | 2097152 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 60 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Output Enable | NO | |
Package Body Material | UNSPECIFIED | |
Package Code | DIP | |
Package Equivalence Code | DIP60,.6 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B (Modified) | |
Standby Current-Max | 0.14 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 1.18 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for EDI8M3264C55C6B
This table gives cross-reference parts and alternative options found for EDI8M3264C55C6B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8M3264C55C6B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MS3264FKXI-55 | SRAM Module, 256KX8, 55ns, CMOS | APTA Group Inc | EDI8M3264C55C6B vs MS3264FKXI-55 |
DPS6433-45C | SRAM Module, 64KX32, 45ns, CMOS | Twilight Technology Inc | EDI8M3264C55C6B vs DPS6433-45C |
MS3264FKXL-55 | SRAM Module, 256KX8, 55ns, CMOS | APTA Group Inc | EDI8M3264C55C6B vs MS3264FKXL-55 |
IDT7M4017S40C | SRAM Module, 64KX32, 40ns, CMOS | Integrated Device Technology Inc | EDI8M3264C55C6B vs IDT7M4017S40C |
MS3264FKXL-25 | SRAM Module, 256KX8, 25ns, CMOS | APTA Group Inc | EDI8M3264C55C6B vs MS3264FKXL-25 |
DPS6433-70I | SRAM Module, 64KX32, 70ns, CMOS | Twilight Technology Inc | EDI8M3264C55C6B vs DPS6433-70I |
IDT7M4017S45C | SRAM Module, 64KX32, 45ns, CMOS | Integrated Device Technology Inc | EDI8M3264C55C6B vs IDT7M4017S45C |
DPS6433-85C | SRAM Module, 64KX32, 85ns, CMOS, | Twilight Technology Inc | EDI8M3264C55C6B vs DPS6433-85C |
EDI8F3264C45M6C | SRAM Module, 64KX32, 45ns, CMOS, | Electronic Designs Inc | EDI8M3264C55C6B vs EDI8F3264C45M6C |
DPS6434-120M | SRAM Module, 64KX32, 120ns, CMOS | Twilight Technology Inc | EDI8M3264C55C6B vs DPS6434-120M |