Part Details for EDI8L24128C15BI by White Electronic Designs Corp
Overview of EDI8L24128C15BI by White Electronic Designs Corp
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Part Details for EDI8L24128C15BI
EDI8L24128C15BI CAD Models
EDI8L24128C15BI Part Data Attributes
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EDI8L24128C15BI
White Electronic Designs Corp
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Datasheet
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EDI8L24128C15BI
White Electronic Designs Corp
SRAM Module, 128KX24, 15ns, CMOS, PBGA119, 14 X 22 MM, MO-163, BGA-119
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 14 X 22 MM, MO-163, BGA-119 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 15 ns | |
| JESD-30 Code | R-PBGA-B119 | |
| Length | 22 mm | |
| Memory Density | 3145728 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 24 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX24 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.794 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |