Part Details for EDI8F1664C100PC by Electronic Designs Inc
Results Overview of EDI8F1664C100PC by Electronic Designs Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Smart Cities
Agriculture Technology
Electronic Manufacturing
EDI8F1664C100PC Information
EDI8F1664C100PC by Electronic Designs Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for EDI8F1664C100PC
EDI8F1664C100PC CAD Models
EDI8F1664C100PC Part Data Attributes
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EDI8F1664C100PC
Electronic Designs Inc
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Datasheet
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EDI8F1664C100PC
Electronic Designs Inc
SRAM Module, 64KX16, 100ns, CMOS, PDIP40,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ELECTRONIC DESIGNS INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 100 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T40 | |
| JESD-609 Code | e0 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 16 | |
| Number of Terminals | 40 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.008 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.195 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |