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Part Details for DSPIC33EP256GP506-H/MR by Microchip Technology Inc
Overview of DSPIC33EP256GP506-H/MR by Microchip Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for DSPIC33EP256GP506-H/MR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
DSPIC33EP256GP506-H/MR
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Microchip Technology Inc | 16 Bit DSC, 256KB Flash, 32KB RAM, 60 MHz, 64 Pin, CAN, 3 OpAmp, 4 Comp,PTG,CTMU, Projected EOL: 2039-03-14 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
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$5.2000 / $7.1800 | Buy Now |
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NAC | RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for DSPIC33EP256GP506-H/MR
DSPIC33EP256GP506-H/MR CAD Models
DSPIC33EP256GP506-H/MR Part Data Attributes
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DSPIC33EP256GP506-H/MR
Microchip Technology Inc
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Datasheet
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DSPIC33EP256GP506-H/MR
Microchip Technology Inc
16 Bit DSC 256KB Flash 32KB RAM 60 MHz 64 Pin CAN 3 OpAmp 4 Comp PTG CTMU
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | QFN-64 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.A | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Microchip | |
| Address Bus Width | ||
| Barrel Shifter | YES | |
| Bit Size | 16 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PQCC-N64 | |
| JESD-609 Code | e3 | |
| Length | 9 mm | |
| Low Power Mode | NO | |
| Number of DMA Channels | 4 | |
| Number of External Interrupts | 3 | |
| Number of Terminals | 64 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC64,.35SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| RAM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100; TS 16949 | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 60 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |