Part Details for DSPIC33EP128GM310-E/PF by Microchip Technology Inc
Results Overview of DSPIC33EP128GM310-E/PF by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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DSPIC33EP128GM310-E/PF Information
DSPIC33EP128GM310-E/PF by Microchip Technology Inc is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DSPIC33EP128GM310-E/PF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
DSPIC33EP128GM310-E/PF-ND
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DigiKey | IC MCU 16BIT 128KB FLASH 100TQFP Lead time: 52 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
DSPIC33EP128GM310-
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Avnet Americas | - Trays (Alt: DSPIC33EP128GM310-) RoHS: Compliant Min Qty: 180 Package Multiple: 90 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
|
DISTI #
70540396
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RS | 128KB Flash, 16KB RAM, 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 Op-Amps, CTMU, PTG Min Qty: 90 Package Multiple: 1 Container: Bulk | 0 |
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$9.5400 / $11.2200 | RFQ |
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NAC | 128KB Flash, 16KB RAM, 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 Op-Amps, CTMU, PTG - Package: 100 TQFP 14x14x1m... more RoHS: Compliant Min Qty: 1 Package Multiple: 90 Container: Tray | 0 |
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RFQ |
Part Details for DSPIC33EP128GM310-E/PF
DSPIC33EP128GM310-E/PF CAD Models
DSPIC33EP128GM310-E/PF Part Data Attributes
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DSPIC33EP128GM310-E/PF
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
DSPIC33EP128GM310-E/PF
Microchip Technology Inc
IC,DSP,16-BIT,CMOS,TQFP,100PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | TQFP-100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Microchip | |
| Address Bus Width | ||
| Barrel Shifter | YES | |
| Bit Size | 16 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 4 | |
| Number of External Interrupts | 5 | |
| Number of Serial I/Os | 4 | |
| Number of Terminals | 100 | |
| Number of Timers | 13 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100; TS 16949 | |
| Seated Height-Max | 1.2 mm | |
| Supply Current-Max | 60 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |