Part Details for DSPB56371AF180 by Freescale Semiconductor
Overview of DSPB56371AF180 by Freescale Semiconductor
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DSPB56371AF180
DSPB56371AF180 CAD Models
DSPB56371AF180 Part Data Attributes:
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DSPB56371AF180
Freescale Semiconductor
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Datasheet
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DSPB56371AF180
Freescale Semiconductor
BLANK ROM VERSION 56371
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Bit Size | 24 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 80 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP80,.64SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 86016 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |