Part Details for DS8113-JNG+ by Analog Devices Inc
Results Overview of DS8113-JNG+ by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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DS8113-JNG+ Information
DS8113-JNG+ by Analog Devices Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DS8113-JNG+
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
700-DS8113-JNG
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Mouser Electronics | Smart Card Interface ICs Smart Card Interface RoHS: Compliant | 130 |
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$1.7800 / $5.0200 | Buy Now |
|
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Analog Devices Inc | Smart Card Interface Package Multiple: 1 | 18165 |
|
$1.7875 / $5.0200 | Buy Now |
Part Details for DS8113-JNG+
DS8113-JNG+ CAD Models
DS8113-JNG+ Part Data Attributes
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DS8113-JNG+
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
DS8113-JNG+
Analog Devices Inc
Smart Card Interface, 28-TSSOP_4.4-4.4_MM, 28 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 28-TSSOP_4.4-4.4_MM | |
| Package Description | TSSOP-28 | |
| Pin Count | 28 | |
| Manufacturer Package Code | 28-TSSOP_4.4-4.4_MM | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2008-02-01 | |
| Samacsys Manufacturer | Analog Devices | |
| JESD-30 Code | R-PDSO-G28 | |
| JESD-609 Code | e3 | |
| Length | 9.7 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 28 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max | 6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |