Datasheets
DS24L65P+ by:
Maxim Integrated Products
Analog Devices Inc
Maxim Integrated Products
Not Found

Microprocessor Circuit, CMOS, PDSO6, ROHS COMPLIANT, TSOC-6

Part Details for DS24L65P+ by Maxim Integrated Products

Results Overview of DS24L65P+ by Maxim Integrated Products

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Healthcare

DS24L65P+ Information

DS24L65P+ by Maxim Integrated Products is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for DS24L65P+

Part # Distributor Description Stock Price Buy
DISTI # 505-DS24L65P+-ND
DigiKey IC AUTHENTICATION CHIP 6-TSOC Min Qty: 240 Lead time: 10 Weeks Container: Tube Temporarily Out of Stock
  • 240 $2.2494
$2.2494 Buy Now

Part Details for DS24L65P+

DS24L65P+ CAD Models

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DS24L65P+ Part Data Attributes

DS24L65P+ Maxim Integrated Products
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DS24L65P+ Maxim Integrated Products Microprocessor Circuit, CMOS, PDSO6, ROHS COMPLIANT, TSOC-6
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC
Package Description ROHS COMPLIANT, TSOC-6
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.31.00.01
JESD-30 Code R-PDSO-C6
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Terminals 6
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOC
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form C BEND
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

DS24L65P+ Frequently Asked Questions (FAQ)

  • A good PCB layout for the DS24L65P+ involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded cable and twisting the data lines can help reduce EMI.

  • To ensure reliable operation of the DS24L65P+ in high-temperature environments, it is essential to provide adequate heat sinking, use a thermally conductive PCB material, and ensure good airflow around the device. Additionally, derating the device's power consumption and using a thermal interface material can help reduce thermal stress.

  • When using the DS24L65P+ in a system with multiple voltage domains, it is essential to ensure that the device's input and output voltage levels are compatible with the system's voltage domains. Additionally, using level translators or voltage regulators may be necessary to ensure proper signal transmission and to prevent damage to the device.

  • To troubleshoot issues with the DS24L65P+, start by verifying the power supply voltage, checking for proper signal transmission, and ensuring that the device is properly configured. Use oscilloscopes or logic analyzers to monitor the device's input and output signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.

  • When using the DS24L65P+ in a system with high-speed signals, it is essential to ensure that the device's input and output signals are properly terminated, and that the PCB layout is optimized for high-speed signal transmission. Additionally, using signal integrity analysis tools can help identify and mitigate signal integrity issues.