Datasheets
DPZ4MX16NV3-12I by:

Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

Part Details for DPZ4MX16NV3-12I by B&B Electronics Manufacturing Company

Overview of DPZ4MX16NV3-12I by B&B Electronics Manufacturing Company

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Part Details for DPZ4MX16NV3-12I

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DPZ4MX16NV3-12I Part Data Attributes

DPZ4MX16NV3-12I B&B Electronics Manufacturing Company
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DPZ4MX16NV3-12I B&B Electronics Manufacturing Company Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Part Life Cycle Code Obsolete
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Part Package Code PGA
Package Description 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Pin Count 66
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 120 ns
Additional Feature AUTOMATIC WRITE
Alternate Memory Width 8
JESD-30 Code S-CPGA-P66
Memory Density 67108864 bit
Memory IC Type FLASH MODULE
Memory Width 16
Number of Functions 1
Number of Terminals 66
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Programming Voltage 12 V
Qualification Status Not Qualified
Seated Height-Max 10.16 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade INDUSTRIAL
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Type NOR TYPE

Alternate Parts for DPZ4MX16NV3-12I

This table gives cross-reference parts and alternative options found for DPZ4MX16NV3-12I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPZ4MX16NV3-12I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DPZ8MX16NV3-12M Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ8MX16NV3-12M
DPZ4MX16NV3-12M Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ4MX16NV3-12M
DPZ4MX16NV3-12C Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ4MX16NV3-12C
DPZ4MX16NV3-12B Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ4MX16NV3-12B
DPZ8MX16NV3-12I Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ8MX16NV3-12I
DPZ8MX16NV3-12C Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ8MX16NV3-12C
Part Number Description Manufacturer Compare
WF2M32B-90HM5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32B-90HM5
WF2M32B-90HC5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32B-90HC5A
WF2M32-80H2M Flash Module, 8MX8, 80ns, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp DPZ4MX16NV3-12I vs WF2M32-80H2M
WF2M32-150HM5A Flash Module, 2MX32, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32-150HM5A
DPZ8MX16NV3-12B Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ4MX16NV3-12I vs DPZ8MX16NV3-12B
WF2M32BI-120HI5 Flash Module, 8MX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32BI-120HI5
WF2M32B-150HI5A Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32B-150HI5A
WF2M32B-150HM5A Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc DPZ4MX16NV3-12I vs WF2M32B-150HM5A
WF2M32BI-90HM5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc DPZ4MX16NV3-12I vs WF2M32BI-90HM5
WF2M32B-90HI5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ4MX16NV3-12I vs WF2M32B-90HI5

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