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Overview of DPSZ384X16BIA3-ABS by B&B Electronics Manufacturing Company
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DC2012A | Analog Devices | LT8610A/AB Demo Board - 5.5V t | |
10033527-N3112BLF | Amphenol Communications Solutions | MINI USB AB TYPE | |
MUSBK152M0 | Amphenol Communications Solutions | Rugged USB, Gen 1, Micro AB |
CAD Models for DPSZ384X16BIA3-ABS by B&B Electronics Manufacturing Company
Part Data Attributes for DPSZ384X16BIA3-ABS by B&B Electronics Manufacturing Company
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
DPAC TECHNOLOGIES CORP
|
Package Description
|
PGA, PGA50,5X10
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
JESD-30 Code
|
R-XPGA-P50
|
JESD-609 Code
|
e0
|
Memory IC Type
|
MEMORY CIRCUIT
|
Mixed Memory Type
|
FLASH+SRAM
|
Number of Terminals
|
50
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Package Body Material
|
CERAMIC
|
Package Code
|
PGA
|
Package Equivalence Code
|
PGA50,5X10
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Qualification Status
|
Not Qualified
|
Standby Current-Max
|
0.0000045 A
|
Supply Current-Max
|
0.39 mA
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
HYBRID
|
Temperature Grade
|
MILITARY
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
PIN/PEG
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
PERPENDICULAR
|