Memory
DPS32M8ANS-55B
Description: Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, SIDE BRAZED, DIP-28

Overview of DPS32M8ANS-55B by Twilight Technology Inc

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Part Data Attributes for DPS32M8ANS-55B by Twilight Technology Inc

DPS32M8ANS-55B
Twilight Technology Inc
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
Length
35.56 mm
Memory Density
262144 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
4.191 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
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  1. DPS32M8ANS-55B
    Twilight Technology Inc
    Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, SIDE BRAZED, DIP-28
    VS

Alternate Parts for DPS32M8ANS-55B

This table gives cross-reference parts and alternative options found for DPS32M8ANS-55B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS32M8ANS-55B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MSM832SLMC-55 Standard SRAM, 32KX8, 55ns, CMOS, CDIP28 APTA Group Inc DPS32M8ANS-55B vs MSM832SLMC-55
CY7C198-55DC Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Cypress Semiconductor DPS32M8ANS-55B vs CY7C198-55DC
CMCP-65656V-55 Standard SRAM, 32KX8, 55ns, CMOS, CDIP28 Matra MHS DPS32M8ANS-55B vs CMCP-65656V-55
JM38510/29307BYA Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Micross Components DPS32M8ANS-55B vs JM38510/29307BYA
HY62256BLP-55I Standard SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 SK Hynix Inc DPS32M8ANS-55B vs HY62256BLP-55I
5962-8855208XA Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Electronic Designs Inc DPS32M8ANS-55B vs 5962-8855208XA
5962-8855203XA 5.0V 32K x 8 Asynchronous Static RAM, CDIP13/Tube Renesas Electronics Corporation DPS32M8ANS-55B vs 5962-8855203XA
5962-8866203NX Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 LOGIC Devices Inc DPS32M8ANS-55B vs 5962-8866203NX
5962-8866203XX Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v DPS32M8ANS-55B vs 5962-8866203XX
P4C1256-55CMB Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation DPS32M8ANS-55B vs P4C1256-55CMB
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp DPS32M8ANS-55B vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor DPS32M8ANS-55B vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors DPS32M8ANS-55B vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd DPS32M8ANS-55B vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd DPS32M8ANS-55B vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp DPS32M8ANS-55B vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp DPS32M8ANS-55B vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited DPS32M8ANS-55B vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp DPS32M8ANS-55B vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics DPS32M8ANS-55B vs IMS1820W-35

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