Part Details for DPS256X32BV3-20C by B&B Electronics Manufacturing Company
Overview of DPS256X32BV3-20C by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS256X32BV3-20C
DPS256X32BV3-20C CAD Models
DPS256X32BV3-20C Part Data Attributes
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DPS256X32BV3-20C
B&B Electronics Manufacturing Company
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Datasheet
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DPS256X32BV3-20C
B&B Electronics Manufacturing Company
SRAM Module, 256KX32, 20ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
Part Package Code | PGA | |
Package Description | PGA, PGA66,11X11 | |
Pin Count | 66 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 20 ns | |
Alternate Memory Width | 16 | |
I/O Type | COMMON | |
JESD-30 Code | S-CPGA-P66 | |
JESD-609 Code | e0 | |
Memory Density | 8388608 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 66 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX32 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA66,11X11 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 10.16 mm | |
Standby Current-Max | 0.002 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR |
Alternate Parts for DPS256X32BV3-20C
This table gives cross-reference parts and alternative options found for DPS256X32BV3-20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256X32BV3-20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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WS256K32L-20HIA | SRAM Module, 256KX32, 20ns, CMOS, CHIP66, CERAMIC, HIP-66 | White Microelectronics | DPS256X32BV3-20C vs WS256K32L-20HIA |
WS256K32L-25HCA | SRAM Module, 256KX32, 25ns, CMOS, CHIP66, CERAMIC, HIP-66 | White Microelectronics | DPS256X32BV3-20C vs WS256K32L-25HCA |
DPS256X32V3-12M | SRAM Module, 256KX32, 120ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-20C vs DPS256X32V3-12M |
DPS256C32BV3-45C | SRAM Module, 256KX32, 45ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.460 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-20C vs DPS256C32BV3-45C |
DPS256X32V3-10I | SRAM Module, 256KX32, 100ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-20C vs DPS256X32V3-10I |
DPS256X32V3-85B | SRAM Module, 256KX32, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32BV3-20C vs DPS256X32V3-85B |
DPS256X32V3-15C | SRAM Module, 256KX32, 150ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-20C vs DPS256X32V3-15C |
WS256K32N-25HI | SRAM Module, 256KX32, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | White Electronic Designs Corp | DPS256X32BV3-20C vs WS256K32N-25HI |
DPS256C32BV3-45M | SRAM Module, 256KX32, 45ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.460 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-20C vs DPS256C32BV3-45M |
DPS256X32V3-25I | SRAM Module, 256KX32, 25ns, CMOS, CPGA66, STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32BV3-20C vs DPS256X32V3-25I |