Part Details for DPS128X8CA3-30C by B&B Electronics Manufacturing Company
Overview of DPS128X8CA3-30C by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS128X8CA3-30C
DPS128X8CA3-30C CAD Models
DPS128X8CA3-30C Part Data Attributes
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DPS128X8CA3-30C
B&B Electronics Manufacturing Company
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Datasheet
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DPS128X8CA3-30C
B&B Electronics Manufacturing Company
SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
Part Package Code | PGA | |
Package Description | APGA, PGA50,5X10 | |
Pin Count | 50 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 30 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CPGA-P50 | |
JESD-609 Code | e0 | |
Length | 25.146 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 50 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | APGA | |
Package Equivalence Code | PGA50,5X10 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, PIGGYBACK | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.207 mm | |
Standby Current-Max | 0.00025 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.14 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 13.716 mm |
Alternate Parts for DPS128X8CA3-30C
This table gives cross-reference parts and alternative options found for DPS128X8CA3-30C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS128X8CA3-30C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DPS128X8CA3-30B | SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DPS128X8CA3-30C vs DPS128X8CA3-30B |
DPS128X8CA3-30I | SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DPS128X8CA3-30C vs DPS128X8CA3-30I |
DPS128X8CA3-30I | SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DPS128X8CA3-30C vs DPS128X8CA3-30I |
DPS128X8CA3-30B | SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DPS128X8CA3-30C vs DPS128X8CA3-30B |