Part Details for DPS128X8A3-10I by B&B Electronics Manufacturing Company
Overview of DPS128X8A3-10I by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS128X8A3-10I
DPS128X8A3-10I CAD Models
DPS128X8A3-10I Part Data Attributes
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DPS128X8A3-10I
B&B Electronics Manufacturing Company
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Datasheet
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DPS128X8A3-10I
B&B Electronics Manufacturing Company
SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
Part Package Code | PGA | |
Package Description | APGA, PGA50,5X10 | |
Pin Count | 50 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 100 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CPGA-P50 | |
JESD-609 Code | e0 | |
Length | 25.146 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 50 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX8 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | APGA | |
Package Equivalence Code | PGA50,5X10 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, PIGGYBACK | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.207 mm | |
Standby Current-Max | 0.000085 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.075 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 13.716 mm |
Alternate Parts for DPS128X8A3-10I
This table gives cross-reference parts and alternative options found for DPS128X8A3-10I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS128X8A3-10I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DPS128X8A3-10M | SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DPS128X8A3-10I vs DPS128X8A3-10M |
DPS128X8A3-10M | SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DPS128X8A3-10I vs DPS128X8A3-10M |
DPS128X8A3-10C | SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DPS128X8A3-10I vs DPS128X8A3-10C |
DPS128X8A3-10C | SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DPS128X8A3-10I vs DPS128X8A3-10C |
DPS128X8A3-10I | SRAM Module, 128KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DPS128X8A3-10I vs DPS128X8A3-10I |