Part Details for DMP1096UCB4-7 by Diodes Incorporated
Overview of DMP1096UCB4-7 by Diodes Incorporated
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Internet of Things (IoT)
Industrial Automation
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Part Details for DMP1096UCB4-7
DMP1096UCB4-7 CAD Models
DMP1096UCB4-7 Part Data Attributes
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DMP1096UCB4-7
Diodes Incorporated
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Datasheet
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DMP1096UCB4-7
Diodes Incorporated
Small Signal Field-Effect Transistor, 2.4A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, WL-CSP1010H6-4, 4 PIN
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | DIODES INC | |
Part Package Code | CSP | |
Package Description | GRID ARRAY, S-PBGA-B4 | |
Pin Count | 4 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Samacsys Manufacturer | Diodes Incorporated | |
Additional Feature | HIGH RELIABILITY | |
Configuration | SINGLE WITH BUILT-IN DIODE AND RESISTOR | |
DS Breakdown Voltage-Min | 12 V | |
Drain Current-Max (ID) | 2.4 A | |
Drain-source On Resistance-Max | 0.152 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | S-PBGA-B4 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 4 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | P-CHANNEL | |
Power Dissipation-Max (Abs) | 0.82 W | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |