Part Details for DM355SZCE135 by Texas Instruments
Overview of DM355SZCE135 by Texas Instruments
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Part Details for DM355SZCE135
DM355SZCE135 CAD Models
DM355SZCE135 Part Data Attributes:
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DM355SZCE135
Texas Instruments
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DM355SZCE135
Texas Instruments
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337, Microprocessor IC:Other
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA337,19X19,25 | |
| Pin Count | 337 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 32 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA337,19X19,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 32768 | |
| Seated Height-Max | 1.3 mm | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |